A standard blade for silicon cutting consists of a metal matrix (nickel) with embedded diamond abrasive grains with a grain size of 4-6 µm. Blade width can typically vary between 35 – 250 µm depending on the application.
A standard blade for silicon cutting consists of a metal matrix (nickel) with embedded diamond abrasive grains with a grain size of 4-6 µm. Blade width can typically vary between 35 – 250 µm depending on the application.