Dicing
Dicing is a metal-cutting process that uses peripheral grinding wheels to profile or cut substrates. The blade widths of such grinding blades can be very thin, with values in the two-digit micrometre range, allowing very fine cuts to be produced.
Dicing blade
A standard blade for silicon cutting consists of a metal matrix (nickel) with embedded diamond abrasive grains with a grain size of 4-6 µm. Blade width can typically vary between 35 – 250 µm depending on the application.