Reactive ion deep etching
Reactive ion deep etching (also known as the Bosch process) is a dry etching process that produces a particularly anisotropic etch profile. Through an iterative process sequence of etching and passivation, the sidewalls of the material can be protected in already etched cavities, creating very deep structures.
Reactive ion deep etching
Reactive ion deep etching – also known as the Bosch process – is a dry etching process that can be used to create anisotropic etch profiles in silicon. This is possible thanks to the two steps, etching and passivation, which are carried out alternately.