Research

ITA | ITA develops an innovative 3D printing process to create conductive tracks directly on component surfaces. The process is transferrable to various substrate materials and types of components and is supposed to be faster and more environmental-friendly than established processes.

LZH |Modern materials give passenger cabins a high safety standard. The only drawback: With conventional life-saving equipment, car body parts often cannot be cut quickly enough in case of an emergency. The solution: an innovative mobile laser device for complex accident scenarios.

IFUM | Undesirable vibrations can be generated by the transfer systems used for the fully automated component transfer between several subsequent forming processes. For this reason, researchers at IFUM are developing a system that minimizes the vibrations occurring during transport, thus increasing the productivity of the forming systems.

IFW, ITV | To increase the efficiency of combustion engines, researchers of IFW and ITV are doing research on how to reduce friction losses in engines. For this purpose, they are machining micro dimples in cylinder liners to investigate their friction-reducing properties.

IW | Corundum blasting used as a pre-treatment of coating surfaces is more and more replaced by machining processes. Researchers are developing an innovative combination of processes for the form-locked bonding of thermally sprayed coatings.

match | Environment-friendly innovation using fibre composites is impeded by tight forming limits combined with a challenging automation process. In this context, the Institute of Assembly Technology (match) is developing a method for automated mass production.

IFA | Practical experience: The workshop on production controlling organised by IFA shows the potential of data-based, real-time evaluations and intelligent support systems for an improved production logistics in companies.

IFW | Creating material flow simulations for bottleneck analyses, factory planning or stock analyses requires a lot of initial effort. IFW is currently developing a procedure that scans the production facilities and then creates a digital simulation model in an automated process.

ITA | To enable the production of larger quantities of smaller chips, ITA is investigating an ultra-fast assembly technology for electronic components. The researchers are using laser technology for the contactless transfer of bare chips onto a substrate.